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NANO-MASTER Headquarters

NANO-MASTER, USA was founded in 1992 as a wholly-owned subsidiary of NANO-MASTER, S.A., France, a leading metrology company in defect inspection and high speed overlay measurement. Subsequent to the closing down of Nano-Master S.A. in 1993, Dr. Birol Kuyel took over the ownership of NANO-MASTER, USA. Later, the name was changed to NANO-MASTER, Inc., which has now become a 100% privately owned US company. NANO-MASTER started design and development of research tools in 2000 and focused on thin film applications. The first tool was a Sputtering System followed by a PECVD System and later a Wafer Cleaner System and ALD System were delivered. NANO-MASTER products are used in Semiconductor, MEMS, Optoelectronics, Nanotechnology and Photovoltaic applications. Some of the products are PECVD Systems for deposition of SiO2, Si3N4, DLC and CNT; PA-MOCVD Systems for InGaN and AlGaN; Sputtering Systems (reactive, co-sputtering, combinatorial); Thermal and E-Beam Evaporators, Ion Beam Etching and Reactive Etching Systems; Atomic Layer Deposition Tools; Megasonic Cleaning Systems and Photoresist Stripping Equipment.


NTE-3500 

Thermal Evaporation Systems

NTE-3500 - Thermal Evaporator System

NANO-MASTER’s NTE-3000 is a PC controlled tabletop thermal evaporation system with a wide range of applications in organic and metal evaporation. It is a 2kVA system with SCR controlled current and a rotating platen. It is designed with extreme care to achieve clean, uniform, and reproducible processes on a small footprint. It provides low cost, high quality capabilities for demanding applications in R&D and low scale manufacturing. The NTE-3000 can operate at either a set RMS current or constant deposition rate controlled by closed loop feedback.

The NTE-4000 is a standalone thermal evaporator system allowing more room for additional capabilities and options such as larger SS chambers, substrate cleaning and cooling, co-evaporation, dual chamber evaporation, and sputtering system configurations.

Features

  • 13” Bell Jar / Cylindrical 10” SS / Cubical 14” SS chamber options
  • 2 evaporation sources
  • Water cooled evaporation feedthrus
  • Switching circuitry for sequential evaporation
  • SCR circuitry for accurate control
  • Individual source and substrate shutters
  • Cross contamination shields
  • Quartz crystal thickness sensor
  • Twist lock mechanism for substrate holder load/unload
  • Substrate rotation
  • Closed loop evaporation control
  • PC based fully automatic recipe or manually driven control system
  • State of the art user interface
  • EMO protection and safety interlocks
Options

  • Substrate heating up to 800°C or cooling
  • Glancing Angle Deposition (GLAD) with rotation
  • Planetary substrate holder
  • Additional power module for co-evaporation
  • Additional evaporation sources up to 6
  • Substrate RF/DC bias
  • Ion source for substrate cleaning
  • Magnetron source for sputtering
  • MFC’s for reactive sputtering/evaporation
  • Automatic load/unload
  • Various pumping options including cryo pumping stations
Applications

  • Metallization in IC interconnects
  • Organics Field Effect Transistors
  • Metal contact layer in CIGS Applications

 Thermal Evaporation Katalog – İndir

NEE-4000

E-Beam Systems

NEE-4000 E-Beam System

The Electron Beam Evaporation System is available in two different configurations. A compact vertical dual chamber configuration features a 16″ cube main chamber where the platen is located underneath a secondary chamber for housing the e-beam source. This configuration can be provided with a gate valve between the two chambers to be used as a load lock to keep the e-beam source and the evaporation pockets in vacuum while substrates are loaded and unloaded from the main chamber. For applications where automatic loading and unloading of wafers is needed, a third load lock chamber is attached to the left face of the cube. In this case, the main chamber can be kept at low 10-7Torr range at all times, and evaporation can start just a few minutes after loading the wafer

The second configuration features a single large chamber design that allows for more capabilities to be packaged into the base plate such as e-beam evaporation guns, magnetrons, and thermal evaporator boats. This configuration can also be used with planetary rotation substrate holders.

Co-evaporation capability with multiple e-beam sources and the ability to program compositions or compositional gradients through PC control can be provided.

Features

  • Electro-polished 14” cubical or 21”x21”x22” 304L SS chamber optimized for evaporation
  • 5 x 10-7 Torr base pressure attained with turbo molecular pumping package
  • 4 x 15cc pocket E-gun
  • Source and substrate shutters
  • 6Kw switching power supply with superior arc suppression
  • Automatic pocket indexing and programmable sweep controller
  • 26” x 44” footprint with enclosed panels ideal for clean rooms
  • Quartz crystal thickness sensor
  • Substrate rotation
  • PC based fully automatic recipe or manually driven control system
  • State of the art user interface
  • EMO protection and safety interlocks
Options

  • Substrate heating up to 800°C or cooling
  • Glancing Angle Deposition (GLAD) with rotation
  • Planetary substrate holder
  • Substrate RF/DC bias
  • Dual gun setup for co-evaporation
  • Ion source for substrate cleaning and ion assisted evaporation
  • Additional PVD sources (thermal, sputtering)
  • MFC’s for reactive evaporation
  • Automatic load/unload
  • Various pumping options
Applications

  • Lift Off Evaporation
  • Optical Coatings
  • Thin Film Transistors
  • Active CIGS layer
  • OLED

E-Beam Katalog – İndir

NSC-4000 Sputtering Systems

(with auto load/unload sputter-up configuration)

NSC-4000 Sputtering Coater

NANO-MASTER’s state-of-the-art Sputtering Systems can be constructed with various chamber and source configurations to efficiently deposit metal and dielectric thin films on to substrates up to 200mm. The systems can be equipped with DC, RF and Pulsed DC power supplies to enable sequential or co-sputtering. The systems are pumped with a turbomolecular pumping package to achieve a base pressure of 5×10-7 Torr. Magnetron to substrate distance is adjustable in order to achieve desired uniformity and deposition rate. Rotating platen with off axis magnetrons provide means of achieving the best film uniformity. Crystal thickness monitor is provided for terminating process automatically. Substrate holders can be heated up to 800°C while rotating and RF biased.

Features

  • Electro-polished 14” cubical chamber optimized for sputtering
  • 5 x 10-7 torr base pressure attained with turbo molecular pumping package
  • Single or multi magnetron configuration with varying cathode size
  • Sequential sputtering
  • Adjustable magnetron to substrate distance
  • 1” to 6” planar magnetron sizes
  • Source and substrate shutters
  • Mass flow controller with electro polished gas lines
  • 4” viewport with manual shutter
  • Quartz crystal thickness sensor
  • Substrate rotation
  • PC based fully automatic recipe or manually driven control system
  • State of the art user interface
  • EMO protection and safety interlocks
Options

  • Substrate heating up to 800°C or cooling
  • Glancing Angle Deposition (GLAD) with rotation
  • Various chamber sizes
  • 1.5-5Kw Pulsed DC power supply for ITO/ZnO like materials
  • Planetary substrate holder
  • In-situ tilting for magnetrons
  • RF biased substrate
  • Ion source for substrate cleaning
  • Ion assisted sputtering
  • Additional power supplies (RF/DC) for co-sputtering
  • Additional PVD sources (thermal, e-beam)
  • Additional MFC’s for reactive sputtering
  • Automatic load/unload
  • Various pumping options including cryo pumping stations
Applications

  • Optical coatings, and ITO Coatings
  • Decorative coatings
  • Hard coatings
  • Protective coatings
  • Microelectronics patterning

Sputtering Katalog – İndir


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