Ultron Systems, Inc. is a privately owned corporation established in 1982, with the goal of providing quality assembly equipment and products for the Semiconductor and Electronics Industries.
We continually strive to enhance our product line and to add newly developed equipment and tape to meet the growing demands of the semiconductor industry.
Ultron Systems offers a wide range of precision and value-oriented semiconductor assembly equipment in both manual- and fully-automatic models, as well as one of the largest selections of semiconductor adhesive plastic tape — which include everything from conventional “blue tape” to our industry leading Silicone-Free and UV tapes — for dicing and backgrinding processes.
Ultron Systems, Inc. market products worldwide, with sales representatives located in key markets throughout the USA, Europe, and Asia. We are located in Moorpark, California, which is approximately 45 miles north of Los Angeles.
Model UH114 Series: (UH114, UH114-8, UH114-12)
Ultron Systems’ Model UH114 & UH115 Series Mounters set the benchmark for both control and versatility. For dicing/sawing applications, uniform adhesive plastic film lamination is paramount. Our mounters feature an easily adjustable spring-loaded roller assembly, along with film-tensioner bars along both the x- and y-axes to ensure bubble-free lamination of the film to the wafer and film frame. In addition, both models feature a retractable film cutting system with adjustable cutting pressure to accommodate various tape base materials and thicknesses. Roller pressure is adjusted from the topside of the units for different process requirements and to accommodate various wafer thicknesses. A digital temperature controller ensures consistent workstage temperatures for repeatable mounting. Adjustable alignment pins and vacuum cups accommodate almost any type of film frame, including plastic. The workstage height is also adjustable relative to the frame height for different wafer thicknesses. Using our Mounters, operator variables are virtually eliminated.
Model UH115 Series: (UH115, UH115-8, UH115-12)
Based on the highly successful Model UH114 Series Wafer/Frame Film Applicators, the Model UH115 represents the next level of bubble-free film lamination to all sizes of wafers and types of film frames. The Model UH115 Series Mounters feature a semiautomatic one-pass lamination which provides an extra margin of safety when mounting particularly fragile wafers/substrates. Most manual mounters laminate the film in two passes, i.e., one pass as the film is laminated to the film frame and wafer/substrate, and a second relaminating pass as the roller returns to its home position. The Model UH115 Series, however, laminates on the first pass only; the second pass is contact-free. Additionally, the film unwinds along a new roller path so that “crease lines” — which are common to most film mounters and occur at the point the unwound film meets the film roll — are eliminated from the lamination area. Adjustable circle cutting pressure accommodates adhesive plastic film of various thicknesses.
Features of UH114 and UH115 Series
Our mounters are available in 6″, 8″, and 12″ wafer / film frame models and features:
– Easily adjustable spring-loaded roller assembly
– Uniform film tension: Film tensioner bars
– Automatic motor-driven, one-pass uniform film lamination
– Three modes of laminating roller operation: fast, slow, or momentary