At Loadpoint we have been designing and manufacturing dicing saws and precision micro-machining equipment for over 40 years. We have many machines in operation on sites around the globe and work actively with a network of international agents. We have an enviable reputation for building very reliable high specification machines that are genuinely built to last. We regularly service machines that have been at work in a production environment for over 30 years. Loadpoint works with clients to ensure the final machine specification is totally suitable for their application. We are able to customise and adapt the machine control software to specifically satisfy our customer’s requirements. Our well-equipped demonstration area also undertakes sub contract cutting for companies who don’t have the volume of work to justify their own machines or are in the process of building up volume. We employ our own service engineers so you can be assured your machines will get the best of care in the future. Our technical support team is available to help with any advice you may need and with the online diagnostics system built into all our new machines, we can even go so far as to design and download production programmes directly to your machine. Loadpoint are proud to be the only manufacturer of dicing systems in Europe.
From prototyping to production and everything in-between.
The MicoAce 66 is a 6” semi-automatic wafer saw with an impressive Z-lift of 20mm for demanding thick substrate applications. The 66 can be used for a wide range of applications, not just for cutting silicon wafers. It offers a high level of configurability to get the best performance out of your application.
Underpinning the MicroAce 66’s performance is the Loadpoint NanoControl control system; a common control platform used across all our machines. NanoControl uses a Loadpoint developed force-sensitive keypad with integrated tracker ball that provides a highly productive interface that is also robust for many years of service.
Another feature of NanoControl is that it can be developed bespoke to a customer’s application. This could involve taking the manual hassle out of calculating complex cut patterns or could involve easy generation of 3D cutting profiles.
NanoAce 200 & NanoAce 300
For large area substrates and high performance tolerance requirements.
The NanoAce 200 and NanoAce 300 are 8” and 12” semi-automatic wafer saws with a dual track positioning system for demanding cutting tolerance applications. It offers a high level of configurability to get the best performance out of your application.
For very large area substrates or for high-throughput requirements found in the electronic components industry. High performance tolerance requirements.
The NanoAce 450 is a unique and versatile semi-automatic wafer saw that can be used for advanced component singulation applications and then easily changed over for regular 6”, 8” or 12” applications within a matter of minutes. Like its smaller area NanoAce 300 equivalent, it ultilises a dual track positioning system for demanding cutting tolerance applications.
For heavier duty applications requiring high power spindle delivery and large work areas.
The MacroAce offers a unique blend of dicing machine performance with CNC-like power and work area capability. The spindle’s drive profile is tuned to give maximum power delivery down in the 15-25krpm range, exactly where you need it for heavier duty ceramic & metal cutting applications. Additionally, cut depths of up to 55mm on substrate depths of 85mm and substrate lengths up to 450mm help cement the MacroAce as a best-in-class leader.
The MacroAce is frequently the first-choice system for cutting bulk ceramics and lower frequency PZT sonar arrays.
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